NX15 Handling & Soldering
This page provides handling and soldering guidance for NX15 module assembly.
NX15 is an SMT LGA module. Handle it as a moisture-sensitive and ESD-sensitive component during storage, placement, reflow, and inspection.
Storage Conditions
| Condition | Specification |
|---|---|
| Storage temperature | 5°C to 35°C, unopened |
| Storage humidity | 20% to 70% RH, unopened |
| Shelf life | 12 months from shipment date |
| MSL level | MSL 3 |
| Floor life | ≤168 hours at <30°C / <60% RH |
| Baking | 125°C +5/-0°C, 24 hours, one time max |
| Corrosive atmosphere | Avoid Cl2, NH3, SO2, or NOx |
caution
Track floor life after opening the moisture barrier bag. If the floor life is exceeded, follow the baking requirement before assembly.
Handling Rules
| Rule | Reason |
|---|---|
| Use ESD protection | Prevent electrostatic damage |
| Avoid touching pads | Prevent contamination and soldering issues |
| Inspect before assembly | Check cracks, pad damage, or abnormal surface condition |
| Use vacuum pickup | Pick up from the top surface only |
| Avoid mechanical stress | Prevent module or solder joint damage |
Reflow Profile Summary
| Zone | Temperature | Duration |
|---|---|---|
| Preheat | 25°C to 150°C | 60–120 s |
| Soak | 150°C to 200°C | 60–120 s |
| Reflow peak | ≤260°C | Max 30 s above 250°C |
| Cooling | 260°C to 25°C | <6°C/s ramp-down |
| Number of reflows | — | Maximum 2 times |
caution
Do not exceed the recommended reflow conditions. Excessive heat or repeated reflow can damage the module or degrade RF performance.
Cleaning
Cleaning is not recommended.
Ultrasonic cleaning or liquid immersion may damage internal components or degrade RF performance.
| Cleaning Method | Recommendation |
|---|---|
| Ultrasonic cleaning | Not recommended |
| Liquid immersion | Not recommended |
| Aggressive solvent | Not recommended |
| No-clean process | Preferred when compatible with production process |
Inspection After Reflow
After reflow, inspect the assembly before powering the board.
| Check | Purpose |
|---|---|
| Module alignment | Confirm module is placed correctly |
| Solder bridge | Check for shorts between pads |
| Pad wetting | Confirm solder joints are formed properly |
| Cracks / damage | Check mechanical damage |
| Antenna area | Confirm no unexpected metal or contamination near antenna |
| Power short | Check VDD-to-GND resistance before power-on |
First Power-On After Assembly
Use a current-limited power supply during the first power-on.
| Step | Action |
|---|---|
| 1 | Inspect board visually |
| 2 | Check VDD-to-GND resistance |
| 3 | Set current limit |
| 4 | Apply power |
| 5 | Measure VDD_nRF |
| 6 | Try SWD connection |
| 7 | Flash or run basic firmware |
| 8 | Verify BLE advertising or debug output |
Production Notes
| Item | Recommendation |
|---|---|
| MSL tracking | Record opening time and floor life |
| Reflow count | Do not exceed maximum reflow count |
| ESD control | Use ESD-safe workstations and packaging |
| Traceability | Track lot code and date code |
| Programming | Keep SWD access available for production |
| Test | Include power, programming, and BLE verification tests |