NX15 Module Handling
This page summarizes important handling, packing, storage, and soldering notes for the KORLINX NX15 Series BLE module.
NX15 is an LGA surface-mount module and should be handled using proper ESD, moisture, and reflow process controls.
This page is a Wiki summary for handling reference. For production assembly, always follow the official datasheet, approved manufacturing process, and EMS/SMT process requirements.
Tape and Reel Packing
| Item | Specification |
|---|---|
| Packaging | Tape and reel, SMT feeder ready |
| Moisture Barrier Bag | MSL Level 3 handling |
| Label Information | Part number, quantity, lot code, MSL level, date code |
| Order Contact | sales@samplepcb.co.kr |
Storage Conditions
| Condition | Specification |
|---|---|
| Storage Temperature | 5°C to 35°C, unopened |
| Storage Humidity | 20% to 70% RH, unopened |
| Shelf Life | 12 months from shipment date |
| MSL Level | MSL 3 (IPC/JEDEC J-STD-020) |
| Floor Life | ≤168 hours at <30°C / <60% RH |
| Baking | 125°C +5/-0°C, 24 hours, one time max |
| Corrosive Atmosphere | Avoid Cl₂, NH₃, SO₂, or NOx |
Handling Guidelines
Follow these guidelines when handling NX15 modules:
- Use proper ESD protection.
- Avoid touching LGA pads with bare hands.
- Inspect modules for cracks, shield damage, contamination, or pad damage before assembly.
- Keep modules in the moisture barrier bag until assembly.
- Track floor life after opening the package.
- Use vacuum nozzle pickup on the module top surface only.
- Do not apply mechanical stress to the shield, RF connector, or antenna area.
Reflow Soldering
| Zone | Temperature | Duration |
|---|---|---|
| Preheat | 25°C to 150°C | 60 to 120 s |
| Soak | 150°C to 200°C | 60 to 120 s |
| Reflow Peak | ≤260°C | Max 30 s above 250°C |
| Cooling | 260°C to 25°C | <6°C/s ramp-down |
| Number of Reflows | - | Maximum 2 times |
Do not exceed the recommended reflow peak temperature or number of reflows. Excessive thermal stress may damage the module or degrade RF performance.
Cleaning Notice
Cleaning is not recommended.
The NX15 module is moisture-sensitive. Ultrasonic cleaning or liquid immersion may damage internal components or degrade RF performance.
If cleaning is required by the production process, use only a method approved for the final manufacturing process.
Production Checklist
Before production assembly, confirm the following:
| Check Item | Description |
|---|---|
| MSL control | Confirm MSL Level 3 handling and floor life tracking |
| Storage condition | Confirm unopened storage temperature and humidity |
| Baking condition | Bake only when required and within the approved limit |
| Reflow profile | Confirm peak temperature, soak time, and cooling rate |
| Reflow count | Do not exceed the maximum number of reflows |
| ESD control | Apply ESD-safe handling during storage, inspection, and assembly |
| Visual inspection | Check shield, antenna area, RF connector, and LGA pads |
| Cleaning process | Avoid ultrasonic cleaning or liquid immersion unless approved |