NX15 Module Specifications

This page summarizes the main specifications of the KORLINX NX15 Series BLE module.

It is intended as a quick reference for developers and hardware engineers before reviewing the detailed pin map, antenna, and handling pages.

:::note Specification sources NX15-specific RF, current, and voltage measurements are not available. Values identified as SoC specifications come from the Nordic nRF54L15 Product Specification; they are not measured or guaranteed NX15 module values. Use released KORLINX engineering documents for production design. :::

Key Specifications

Item	Specification
Product Series	NX15 Series
Product Type	Bluetooth Low Energy module
Main SoC	Nordic nRF54L15
CPU	128 MHz Arm Cortex-M33
Coprocessor	128 MHz RISC-V coprocessor
Internal Memory	1.5 MB internal NVM, 256 KB RAM
External Flash	Optional external Flash depending on model
Wireless	Bluetooth LE 5.4
802.15.4 Support	Thread / Zigbee capable
Matter Support	Matter over Thread capable depending on software stack
RF Output Power	Up to +8 dBm for the nRF54L15 CSP package (SoC specification)
RX Sensitivity	−96 dBm, Bluetooth LE 1 Mbps (SoC specification)
Operating Supply Range	1.7 V to 3.6 V; maximum 3.4 V under extended-temperature conditions (SoC specification)
Operating Temperature	−40°C to +85°C; extended operation to +105°C under Nordic's specified conditions (SoC specification)
Power Regulation	Integrated DC-DC and LDO regulators
Package	LGA surface-mount module
Module Size	9.5 × 9.5 × 1.95 mm
Module Weight	< 0.5 g
Pad Pitch	0.65 mm
Interfaces	UART, SPI, I2C, PWM, ADC, PDM, GPIO, SWD
SDK / RTOS	nRF Connect SDK / Zephyr RTOS
Security	Arm TrustZone and nRF54L15 platform security features

Selecting a Model

The antenna and additional-Flash combinations are summarized once on the NX15 Module Overview. After selecting a model, use this page to check the shared electrical, RF, mechanical, memory, and interface specifications.

For antenna-specific integration requirements, continue to the NX15 Module Antenna page.

Mechanical Information

Parameter	Value	Note
Length	9.5 mm	Module body
Width	9.5 mm	Module body
Height	1.95 mm	With shield
Weight	< 0.5 g	Typical target
Package	LGA	Surface-mount module
Pad Pitch	0.65 mm	Landing pattern reference

SoC Absolute Maximum Ratings

danger

These are nRF54L15 CSP-package limits from the Nordic product specification. They are stress limits, not NX15 operating conditions or module qualification results.

Parameter	Symbol	Minimum	Maximum	Unit	Source scope
Supply voltage	VDD	−0.3	3.9	V	nRF54L15 SoC
GPIO voltage, VDD ≤ 3.6 V	VIO	−0.3	VDD + 0.3	V	nRF54L15 SoC
RF input level	—	—	10	dBm	nRF54L15 SoC
Storage temperature	TSTG	−40	+125	°C	nRF54L15 CSP package
Reflow temperature	TREFLOW	—	260	°C	nRF54L15 CSP package; 30 seconds, maximum three cycles
ESD, Human Body Model	—	—	3	kV	nRF54L15 CSP package

SoC Recommended Operating Conditions

Parameter	Symbol	Minimum	Typical	Maximum	Unit
Supply voltage	VDD	1.7	—	3.6	V
Supply voltage, extended temperature	VDD_EXT	1.7	—	3.4	V
Operating temperature	TA	−40	25	+85	°C
Extended operating temperature	TA_EXT	+85	—	+105	°C
GPIO Input High Voltage	VIH	0.7 × VDD_nRF	-	VDD_nRF	V
GPIO Input Low Voltage	VIL	GND	-	0.3 × VDD_nRF	V
GPIO High-Level Output	VOH	VDD_nRF - 0.4	-	VDD_nRF	V
GPIO Low-Level Output	VOL	GND	-	GND + 0.4	V
GPIO Output Current, Standard Drive	IGPIO_SD	-	-	0.5*	mA
GPIO Output Current, High Drive	IGPIO_HD	-	3	5*	mA

* GPIO output current depends on VDD_nRF, drive-strength configuration, load conditions, and firmware settings. Standard-drive output is specified at a 0.5 mA load. High-drive output current is typically 3 mA at VDD_nRF ≥ 1.7 V and up to 5 mA at VDD_nRF ≥ 2.7 V.

Nordic SoC Electrical, RF, and Current Reference

The following values are from the Nordic nRF54L15 Product Specification. They describe the SoC under Nordic's stated conditions and are not NX15 module measurements. Unless a row says otherwise, Nordic's current-consumption conditions use 3 V on VDD, 25°C, and the reference circuit; regulator, clock, and memory conditions depend on the selected scenario.

Item	Typical / Range	Unit	Nordic condition
Arm Cortex-M33 Clock	128	MHz	128 MHz Arm Cortex-M33
RISC-V Coprocessor Clock	128	MHz	128 MHz RISC-V coprocessor
Internal NVM	1.5	MB	Internal NVM
RAM	256	KB	RAM
External Flash	Optional	-	Depending on model
Frequency Band	2402–2480	MHz	BLE 5.4
Maximum TX output power	+8	dBm	CSP package
Bluetooth LE RX sensitivity	−96	dBm	1 Mbps PHY
IEEE 802.15.4 RX sensitivity	−102	dBm	250 kbps PHY
Radio TX current	6.6	mA	+4 dBm, HFXO
Radio TX current	9.8	mA	+8 dBm, HFXO
Radio RX current	3.4	mA	1 Mbps, HFXO
System OFF current	0.7	µA	Wake on pin, 0 KB RAM retained
System ON idle current	2.9	µA	Wake on pin + GRTC/LFXO, 256 KB RAM retained

See Nordic's radio current table and sleep-current table for definitions and test conditions.

Interface Summary

NX15 provides configurable embedded interfaces for host communication, sensor connection, peripheral control, programming, and debugging.

Interface	Available Resources	Typical Use
UART / UARTE	2	Host communication or serial peripheral connection
SPI	3, including SPI up to 32 MHz	External sensors, memory, or high-speed peripheral connection
I2C	2	Sensor or low-speed peripheral connection
PWM	4	LED, buzzer, control, or signal output
ADC	8 channels	Analog input for external sensors
PDM	1	Digital microphone interface
GPIO	P0, P1, and P2 ports	General digital input/output
SWD	SWDIO and SWDCLK	Programming and debugging

caution

GPIO and peripheral functions are configurable by firmware. Confirm the final pin assignment, firmware configuration, and model-specific restrictions before using a pin in a custom design.

Key Specifications​

Selecting a Model​

Mechanical Information​

SoC Absolute Maximum Ratings​

SoC Recommended Operating Conditions​

Nordic SoC Electrical, RF, and Current Reference​

Interface Summary​

Related Pages​