NX40 Handling & Soldering
This page provides handling and soldering guidance for NX40 module assembly.
NX40 should be handled as an ESD-sensitive SMT wireless module during storage, placement, reflow, inspection, and first power-on.
Final storage condition, MSL level, baking condition, and reflow profile should be confirmed from the official NX40 manufacturing or datasheet document.
Handling Rules
| Rule | Reason |
|---|---|
| Use ESD protection | Prevent electrostatic damage |
| Avoid touching pads | Prevent contamination and soldering issues |
| Inspect before assembly | Check visible cracks, pad damage, or abnormal package condition |
| Use proper pick-and-place method | Prevent mechanical damage |
| Avoid mechanical stress | Protect module body and solder joints |
Storage and Floor Life
Track storage and exposure time according to the final NX40 handling specification.
| Item | What to Confirm |
|---|---|
| Storage temperature | Confirm from NX40 handling specification |
| Storage humidity | Confirm from NX40 handling specification |
| MSL level | Confirm before assembly |
| Floor life | Track after opening moisture barrier bag |
| Baking requirement | Apply only according to official guidance |
| Package label | Check part number, quantity, lot code, date code |
Do not reuse NX15 MSL or reflow values for NX40 unless the NX40 document confirms the same requirement.
Reflow Preparation
Before reflow:
| Check | Status |
|---|---|
| Correct module variant prepared | ☐ |
| PCB footprint reviewed | ☐ |
| Paste mask reviewed | ☐ |
| Placement orientation checked | ☐ |
| Moisture handling checked | ☐ |
| Reflow profile confirmed | ☐ |
| ESD-safe handling prepared | ☐ |
Reflow and Assembly
Follow the reflow profile approved for NX40.
| Area | Recommendation |
|---|---|
| Peak temperature | Follow official NX40 reflow profile |
| Number of reflows | Confirm maximum allowed reflow count |
| Heating/cooling rate | Follow assembly process limits |
| Placement | Ensure correct orientation and alignment |
| Solder paste | Use process compatible with module footprint |
| Rework | Avoid unnecessary rework on wireless modules |
Cleaning
Cleaning should be confirmed from the official NX40 handling guidance.
| Cleaning Method | Recommendation |
|---|---|
| Ultrasonic cleaning | Avoid unless explicitly approved |
| Liquid immersion | Avoid unless explicitly approved |
| Aggressive solvent | Avoid unless explicitly approved |
| No-clean process | Preferred when compatible with assembly process |
Post-Reflow Inspection
After reflow, inspect the assembly before applying power.
| Check | Purpose |
|---|---|
| Module alignment | Confirm correct placement |
| Solder bridge | Check for shorts |
| Pad wetting | Confirm solder joints are formed properly |
| Mechanical damage | Check cracks or package damage |
| Antenna area | Confirm no unexpected metal or contamination |
| Power short | Check power-to-ground resistance before power-on |
First Power-On After Assembly
Use a current-limited supply during the first power-on.
| Step | Action |
|---|---|
| 1 | Inspect board visually |
| 2 | Check power-to-ground resistance |
| 3 | Set current limit |
| 4 | Apply power |
| 5 | Measure power rail |
| 6 | Try SWD connection |
| 7 | Flash or run basic firmware |
| 8 | Verify BLE advertising or debug output |
Production Notes
| Item | Recommendation |
|---|---|
| Variant control | Confirm NX40i/NX40E and 32/00 model |
| Firmware pairing | Match firmware to Flash option |
| ESD control | Use ESD-safe workstation and packaging |
| Reflow record | Track reflow process and profile |
| Traceability | Track lot code and date code |
| Programming | Keep SWD access available |
| Functional test | Include power, programming, and BLE verification |