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NX40 PCB Integration

This page provides a practical checklist for integrating the NX40 module into a custom host PCB.

It focuses on board-level integration. Detailed pad/pin grouping is covered in NX40 Pad / Pin Layout, and assembly handling is covered in NX40 Handling & Soldering.


PCB Integration Flow

StepAction
1Select the NX40 model
2Place the module on the host PCB
3Connect power and ground
4Add required decoupling capacitors
5Route SWD programming/debug pins
6Route reset and required GPIO
7Check external Flash option and firmware configuration
8Check chip antenna area or external RF path
9Add test points for bring-up
10Validate the first prototype

Module Placement

Place the module so that power, debug, GPIO, and antenna constraints can be satisfied.

AreaRecommendation
Antenna sideKeep clear from metal, battery, shield, and dense copper
Debug accessKeep SWD pins accessible
Test pointsAdd test points for power, ground, reset, and debug
Mechanical clearanceAvoid locations exposed to cable stress or enclosure pressure
RF validationTest placement with the final enclosure

Power and Ground

Signal / AreaRecommendation
Power railFollow the final NX40 schematic and datasheet
GNDConnect all required ground pads to a solid ground reference
DecouplingPlace capacitors close to power pins
Return pathKeep ground return short and low impedance
Power test pointAdd a test point for measurement
Current limitUse a current-limited supply during first power-on
caution

Do not assume NX15 power values for NX40. Confirm the final NX40 power requirement from the NX40 schematic or datasheet.


Programming and Debug Access

Keep SWD access available during development and production.

SignalPurposeRecommendation
SWDIOProgramming/debug dataRoute to header or test pad
SWDCLKProgramming/debug clockRoute to header or test pad
RESET / NRESETReset and recoveryRoute to header, button, or test pad
GNDDebug referencePlace close to SWD signals
Target voltageDebugger referenceAdd if required by the debugger
tip

Even if the final product does not expose a debug connector, test pads are strongly recommended for flashing, recovery, and production programming.


External Flash Consideration

NX40 models may be built with or without external SPI Flash.

Model TypeIntegration Check
32 modelsConfirm Flash part, routing, and firmware configuration
00 modelsConfirm firmware does not require external Flash
PrototypeCheck Flash read/write or storage behavior early
ProductionVerify correct model and firmware pairing
caution

A mismatch between hardware Flash option and firmware configuration can cause boot failure, storage errors, or unexpected runtime behavior.


GPIO and Peripheral Routing

NX40 GPIO and peripheral signals should be routed according to the firmware board configuration.

InterfaceRouting Note
UARTConfirm TX/RX direction and voltage level
SPIKeep clock and data routing clean
I2CAdd pull-up resistors as required
PWMCheck output load and drive requirement
ADCKeep analog traces away from noisy signals
GPIOConfirm active level, pull-up/down, and wake-up behavior
SWDKeep accessible and avoid unnecessary stubs

Antenna Integration Reminder

This page does not repeat full antenna rules, but antenna constraints must be checked before PCB release.

VariantRequired Check
NX40iChip antenna keep-out and placement
NX40EExternal antenna connector, RF trace, and ground reference

For full details, see the NX40 antenna design page in the NX40 Series BLE Module section.


Bring-up Test Points

Add test points for early validation.

Test PointPurpose
Power railVerify supply voltage
GNDMeasurement reference
SWDIOProgramming/debug
SWDCLKProgramming/debug
RESET / NRESETReset and recovery
UART TX/RXOptional log or host communication
Key GPIOApplication-specific validation

First Prototype Checklist

Before firmware testing:

CheckStatus
Correct NX40 model mounted
Power rail verified
Ground continuity checked
No VDD-to-GND short
Decoupling capacitors installed
SWDIO / SWDCLK accessible
Reset path accessible
Flash option matches firmware
Antenna layout reviewed
No visible soldering defect
Current limit set for first power-on